Trainee Software Engineer jobs in Tamil Nadu

Qualification: Btech/BE Electronics and Communications : 2025/2026 Pass out Bond Period : 15 or 18 Month bond Embedded Firmware Engineer Trainee (EC): - Knowledge with 8/16/32 bit microcontroller (including ARM microcontroller) -good knowledge of C, C++ programming - Know how for RTOS is preferable -Knowledge of protocols and interfaces such as UART, USART, SPI, I2C, CAN, LIN, Ethernet,...

Job Summary: The Diagnostic Support Engineer Trainee will be responsible for monitoring DTC (Diagnostic Trouble Codes) and CAN (Controller Area Network) parameters at the Command Center (CC) 24/7. The role involves guiding customers and drivers, managing escalations, and coordinating with dealers to resolve vehicle issues efficiently. Location: Oragadam, Tamil Nadu Industry:...

Qualification: Btech/BE Electronics and Communications : 2025/2026 Pass out Bond Period : 15 or 18 Month bond Embedded Firmware Engineer Trainee (EC): - Knowledge with 8/16/32 bit microcontroller (including ARM microcontroller) -good knowledge of C, C++ programming - Know how for RTOS is preferable -Knowledge of protocols and interfaces such as UART, USART, SPI, I2C, CAN, LIN, Ethernet,...

Job Summary:The Diagnostic Support Engineer Trainee will be responsible for monitoring DTC (Diagnostic Trouble Codes) and CAN (Controller Area Network) parameters at the Command Center (CC) 24/7. The role involves guiding customers and drivers, managing escalations, and coordinating with dealers to resolve vehicle issues efficiently.Location: Oragadam, Tamil NaduIndustry: AutomotiveWorking Days:...

Qualification: Btech/BE Electronics and Communications : 2025/2026 Pass out Bond Period : 15 or 18 Month bond Embedded Firmware Engineer Trainee (EC): - Knowledge with 8/16/32 bit microcontroller (including ARM microcontroller) -good knowledge of C, C++ programming - Know how for RTOS is preferable -Knowledge of protocols and interfaces such as UART, USART, SPI, I2C, CAN, LIN, Ethernet,...

Qualification: Btech/BE Electronics and Communications : 2025/2026 Pass out Bond Period : 15 or 18 Month bond Embedded Firmware Engineer Trainee (EC): - Knowledge with 8/16/32 bit microcontroller (including ARM microcontroller) -good knowledge of C, C++ programming - Know how for RTOS is preferable -Knowledge of protocols and interfaces such as UART, USART, SPI, I2C, CAN, LIN, Ethernet,...

Qualification: Btech/BE Electronics and Communications : 2025/2026 Pass out Bond Period : 15 or 18 Month bond Embedded Firmware Engineer Trainee (EC): - Knowledge with 8/16/32 bit microcontroller (including ARM microcontroller) -good knowledge of C, C++ programming - Know how for RTOS is preferable -Knowledge of protocols and interfaces such as UART, USART, SPI, I2C, CAN, LIN, Ethernet,...

Qualification: Btech/BE Electronics and Communications : 2025/2026 Pass out Bond Period : 15 or 18 Month bond Embedded Firmware Engineer Trainee (EC): - Knowledge with 8/16/32 bit microcontroller (including ARM microcontroller) -good knowledge of C, C++ programming - Know how for RTOS is preferable -Knowledge of protocols and interfaces such as UART, USART, SPI, I2C, CAN, LIN, Ethernet,...

Qualification: Btech/BE Electronics and Communications : 2025/2026 Pass out Bond Period : 15 or 18 Month bond Embedded Firmware Engineer Trainee (EC): - Knowledge with 8/16/32 bit microcontroller (including ARM microcontroller) -good knowledge of C, C++ programming - Know how for RTOS is preferable -Knowledge of protocols and interfaces such as UART, USART, SPI, I2C, CAN, LIN, Ethernet,...

Qualification: Btech/BE Electronics and Communications : 2025/2026 Pass out Bond Period : 15 or 18 Month bond Embedded Firmware Engineer Trainee (EC): - Knowledge with 8/16/32 bit microcontroller (including ARM microcontroller) -good knowledge of C, C++ programming - Know how for RTOS is preferable -Knowledge of protocols and interfaces such as UART, USART, SPI, I2C, CAN, LIN, Ethernet,...

Qualification: Btech/BE Electronics and Communications : 2025/2026 Pass out Bond Period : 15 or 18 Month bond Embedded Firmware Engineer Trainee (EC): - Knowledge with 8/16/32 bit microcontroller (including ARM microcontroller) -good knowledge of C, C++ programming - Know how for RTOS is preferable -Knowledge of protocols and interfaces such as UART, USART, SPI, I2C, CAN, LIN, Ethernet,...

Qualification: Btech/BE Electronics and Communications : 2025/2026 Pass out Bond Period : 15 or 18 Month bond Embedded Firmware Engineer Trainee (EC): - Knowledge with 8/16/32 bit microcontroller (including ARM microcontroller) -good knowledge of C, C++ programming - Know how for RTOS is preferable -Knowledge of protocols and interfaces such as UART, USART, SPI, I2C, CAN, LIN, Ethernet,...

Qualification: Btech/BE Electronics and Communications : 2025/2026 Pass out Bond Period : 15 or 18 Month bond Embedded Firmware Engineer Trainee (EC): - Knowledge with 8/16/32 bit microcontroller (including ARM microcontroller) -good knowledge of C, C++ programming - Know how for RTOS is preferable -Knowledge of protocols and interfaces such as UART, USART, SPI, I2C, CAN, LIN, Ethernet,...

Qualification: Btech/BE Electronics and Communications : 2025/2026 Pass out Bond Period : 15 or 18 Month bond Embedded Firmware Engineer Trainee (EC): - Knowledge with 8/16/32 bit microcontroller (including ARM microcontroller) -good knowledge of C, C++ programming - Know how for RTOS is preferable -Knowledge of protocols and interfaces such as UART, USART, SPI, I2C, CAN, LIN, Ethernet,...

Qualification: Btech/BE Electronics and Communications : 2025/2026 Pass out Bond Period : 15 or 18 Month bond Embedded Firmware Engineer Trainee (EC): - Knowledge with 8/16/32 bit microcontroller (including ARM microcontroller) -good knowledge of C, C++ programming - Know how for RTOS is preferable -Knowledge of protocols and interfaces such as UART, USART, SPI, I2C, CAN, LIN, Ethernet,...

Qualification: Btech/BE Electronics and Communications : 2025/2026 Pass outBond Period : 15 or 18 Month bondEmbedded Firmware Engineer Trainee (EC):- Knowledge with 8/16/32 bit microcontroller (including ARM microcontroller)-good knowledge of C, C++ programming- Know how for RTOS is preferable-Knowledge of protocols and interfaces such as UART, USART, SPI, I2C, CAN, LIN, Ethernet, WiFi,...

Qualification: Btech/BE Mechanical/Automotive/Aero : 2025/2026 Pass out Bond Period : 15 or 18 Month bond Plant-Piping Design Engineer: - Knowledge and interestest in learning modelling tools like AutocadPlant3D / Aveva PDMS /E3D & AutoCAD. - Knowhow of engineering practices & procedure, familiar with International Codes and standard applicable to Piping engineering/design. e.g. API, ASME,...

Qualification: Btech/BE Mechanical/Automotive/Aero : 2025/2026 Pass out Bond Period : 15 or 18 Month bond Plant-Piping Design Engineer: - Knowledge and interestest in learning modelling tools like AutocadPlant3D / Aveva PDMS /E3D & AutoCAD. - Knowhow of engineering practices & procedure, familiar with International Codes and standard applicable to Piping engineering/design. e.g. API, ASME,...

Qualification: Btech/BE Mechanical/Automotive/Aero : 2025/2026 Pass out Bond Period : 15 or 18 Month bond Plant-Piping Design Engineer: - Knowledge and interestest in learning modelling tools like AutocadPlant3D / Aveva PDMS /E3D & AutoCAD. - Knowhow of engineering practices & procedure, familiar with International Codes and standard applicable to Piping engineering/design. e.g. API, ASME,...

Qualification: Btech/BE Mechanical/Automotive/Aero : 2025/2026 Pass out Bond Period : 15 or 18 Month bond Plant-Piping Design Engineer: - Knowledge and interestest in learning modelling tools like AutocadPlant3D / Aveva PDMS /E3D & AutoCAD. - Knowhow of engineering practices & procedure, familiar with International Codes and standard applicable to Piping engineering/design. e.g. API, ASME,...